METHOD FOR FORMING FLIP-CHIP BUMP (PROTUBERANCE) AND UBM FOR HIGH-SPEED COPPER INTERNAL WIRING USING ELECTROLESS PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a flip-chip bump or UBM(underbump metallurgy) for a high-speed copper internal wiring chip in the main. SOLUTION: This method forming a flip-chip bump or UBM for a high-speed copper internal wiring chip, and this method has a step (a) of plating a copper pad with copper, to form a copper plated layer through nonelectrodepositional metal precipitated plating, and a step (b) of plating the plated layer with nickel so as to form a nickel plated layer through electroless plating.