| 摘要 |
The method for mounting of integrated circuits (1) on electrical connection circuits (3) carried by substrates (4) and having pads (5) for connection to integrated circuits, comprises the following steps: the covering of active face of integrated circuits (1) having contacts (2) with a layer of resin which can be reactivated, and for each integrated circuit, the reactivation of resin, and the application of integrated circuit on the side of resin against the electrical circuit and the substrate for fastening the integrated circuit on the substrate with positioning the contacts of integrated circuit vertical to the connection pads of electrical circuit. The covering by the layer of resin (8) is effected when the integrated circuits are associated in the form of a wafer (6), and the wafer is cut after covering to separate the individual integrated circuits. The resin (8) is anisotropic, and is made electrically conducting vertically to the contacts by a local compression in a direction perpendicular to the contacts. In the second embodiment, the resin (8) is insulating, and the pads (10) are formed on the contacts (2) before covering, and after covering the resin is eliminated vertically of pads. The resin is eliminated vertically of pads after covering, and the pads are formed on contacts also uncovered. Preliminary to cutting, the resin is locally eliminated vertically of sawing paths extending between integrated circuits on wafer. The resin is deposited by print in a manner to leave open the sawing paths. An insulating annular barrier (9) projecting from the electrical circuit around connection pads is formed on the substrate before fastening the integrated circuit. |
