| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component by a reflow system with high reliability of electric and mechanical junction. SOLUTION: This method is provided with a coating process for coating the surface of an electrode land on a board 12 with solder paste 14 which contains solder materials and flux; a temporary mounting process for temporarily mounting an electronic component 18 on the board after positioning the electrode terminal of the electronic component on the electrode land coated with solder paste; and a reflow process for making the solder paste reflow inside a reflow furnace, so that the surface mount electronic component for a plurality of blocks having mutually different heat capacity can be mounted on the same planes of the board by the reflow system. Then, series of processes composed of the coating process, the temporary mounting process and the reflow process are repeated for each block of the electronic component, and the temperature inside the reflow furnace in one reflow process is set lower than the temperature inside the reflow furnace in the reflow process preceding to one reflow process.
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