SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To obtain a semiconductor device having a contact structure comprising a highly reliable multi-layer conductive plug by stabilizing electrical connection between upper and lower conductive plugs while preventing short circuit between a conductive plug and an electrode layer. SOLUTION: A reflection prevention film 5 used when a first contact hole 6 is formed is interposed between a first insulation film 4 and a second insulation layer 80 and the reflection prevention film 5 is made an etching prevention film to the first insulation film 4 when a second contact hole 9 is formed in the second insulation layer 80.