| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable board for a printed circuit board for high density mounting and a printed circuit board using the same with which the board and metal wiring are strongly adhered, the warp and twist of the board are reduced and further, thermal expansion, elastic modulus or conductivity can be controlled by forming adhesion layers mainly composed of thermosetting resins 102 on one side or both sides of a resin film 100 with diffused and mixed inorganic fillers 101 more than 15 vol.%. SOLUTION: A film 100 is prepared by diffusing and mixing inorganic fillers 101 of SiO2 or the like more than 15 vol.%, preferably, more than 20 vol.% in a brominated epoxy resin or the like and an adhesive agent 102 is integrally formed on at least one side of that film by diffusing and mixing the inorganic fillers of SiO2 or the like more than 15 vol.%, preferably, more than 20 vol.% in the thermosetting resin such as polyimide resin. |
