| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board with which crack of a connecting conductor charged in a through hole can be effectively prevented and resistance of this connecting hole can be suppressed low. SOLUTION: Concerning a multilayer wiring board, a first wiring layer 2 and a second wiring layer 3 are successively laminated on the upper surface of a substrate 1 while interposing an insulation layer 4, and the first wiring layer 2 and the second wiring layer 3 are electrically connected by a connecting conductor 5 inside a through hole 5 provided on the insulation layer 4. A number of pores 7 having the diameter of 0.1 to 3.0μm are formed inside the connecting conductor 6 and the volume ratio (porosity) of these pores 7 in the connecting conductor 6 is set to 1.2 to 14.5%. |
