发明名称 HOT PLATE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a hot plate device heating surface of which is made to have highly uniform temperature distribution and the heating element of which can be manufactured easily and can be replaced easily with another element, resulting in a reduced maintenance cost. SOLUTION: The hot plate device is provided with a heat conductive heating member 5 having a heating surface 5b for heating an object to be heated and at least one heated-fluid passage 9 and 10 for heating the heating member 5 and swings a heating fluid in the passages 9 and 10 by making the fluid to go in and out of the passages 9 and 10 from openings provided at both ends of the passage 9.
申请公布号 JP2001183063(A) 申请公布日期 2001.07.06
申请号 JP19990365756 申请日期 1999.12.24
申请人 AISIN SEIKI CO LTD 发明人 INOUE TATSUO;MINAMOTO NAOKI;NAKAGAWA TETSUTARO
分类号 H01L21/31;F26B23/10;(IPC1-7):F26B23/10 主分类号 H01L21/31
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