An insulated electric wire suited for soldering which comprises a conductor and an insulating layer of a coating insulating material applied to the conductor and then baked wherein the coating insulating material is of a polyamide-imide formed from reaction among an anhydrotrimellitic acid, aliphatic and aromatic dicarboxylic acids and a diisocyanate compound with a mole ratio of the diisocyanate compound to all of the above-mentioned acids being in a range of 0.9 : 1.0 to 1.1 : 1.0 .