SEMICONDUCTOR ELEMENT TEST DEVICE

摘要

PURPOSE: A semiconductor element test device is provided to transfer exactly signal and prevent a damage of bonding pad by using an electro rheological fluid. CONSTITUTION: A test head(4) is placed in a main body of the semiconductor element test device and receives electric power from a power source. A fluid receptor(6) is mounted on an upper place of the test head(4). The electro rheological fluid(2) is filled into the inner place of the fluid receptor(6). The fluid receptor(6) is made of non-conductibility material such as a plastic material. If the electric power is applied to the test head(4), the electric signal of the test head(4) through the electro rheological fluid(2) is transferred to the semiconductor element.