发明名称 GROUNDING TREATMENT METHOD OF PANEL FILM
摘要 PURPOSE: A grounding treatment method of panel film is provided to improve the productivity with convenient welding job by soldering panel and film after cutting edge face of film as the inclined form, and is provided to prevent transformation of film and to have decrease of inferior welding job and to reproduce inferior film by welding following edge face, and is provided to improve shelter efficiency of electron wave or static electric charge from 10% to 20% by widening for grounding face welding electric conduction layer and double grounding structure of film and panel. CONSTITUTION: A film edge face(21) inclined more than 110 degree and a panel(1) is welded to increase grounding face. A film(2) and panel(1) is welded at the same time after cutting edge of film(2) as the inclined form with welding a corner or edge face(21).
申请公布号 KR20010058268(A) 申请公布日期 2001.07.05
申请号 KR19990062492 申请日期 1999.12.27
申请人 LG ELECTRONICS INC. 发明人 JUNG, HYEON JUN
分类号 H01J29/88;(IPC1-7):H01J29/88 主分类号 H01J29/88
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