| 摘要 |
<p>The invention related to a method of manufacturing a buildup printed-circuit board. First, a printed-circuit board (2) having a first conductor pattern (6, 14) is provided. An insulating layer (16) is formed in such a manner that it includes openings (18) through which parts of the first conductor pattern are exposed. Electroplating is carried out using the first conductor pattern as power line until the openings are filled with conductor (20) up to substantially the same level as the insulating layer. A second conductor pattern (24) connected with the first conductor pattern is then formed on the insulation layer. This method facilitates the manufacture of a buildup printed-circuit board having flat vias.</p> |
