发明名称 PLASMA PROCESSING METHODS
摘要 A workpiece is treated in a vacuum chamber by a plasma struck by capacitative or inductive coupling of RF power. RF power is also supplied to an electrode supporting the workpiece at a high frequency well in excess of 13.56 MHz for all or part of the processing stage in order to control the ion energy distribution. Ideally the high frequency energy applied to the electrode will cause the energy distribution to peak around a single energy.
申请公布号 WO0148789(A1) 申请公布日期 2001.07.05
申请号 WO2000GB04927 申请日期 2000.12.22
申请人 SURFACE TECHNOLOGY SYSTEMS PLC;BHARDWAJ, JYOTI, KIRON;LEA, LESLIE, MICHAEL;BARKER, ANTHONY, JAMES;GRANGE, JACQUES, ANDRE 发明人 BHARDWAJ, JYOTI, KIRON;LEA, LESLIE, MICHAEL;BARKER, ANTHONY, JAMES;GRANGE, JACQUES, ANDRE
分类号 H01J37/32;(IPC1-7):H01J37/32 主分类号 H01J37/32
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