发明名称 |
Wire-contacted pluggable contact arrangement with high density e.g. for electronics and automobiles, uses circuit board having several lamination layers with several sites provided for wire-bonding |
摘要 |
<p>Pluggable contact arrangements for electronics and associated automobile applications are required to prevent vibrational oscillations of the wire connections during operation and also to have a high contact density in the connection array. The proposed pluggable contact arrangement (10) includes several needle contacts in the plug housing (18) where each needle contact has a head-end and a free end. A circuit board (14) having several lamination layers is used and several sites are provided for wire-bonding, where each site for wire-bonding forms a signal-contact for one of the needle contacts, and the sites for wire-bonding are arranged on at least two lamination layers such that the distance between the site for wire-bonding and the needle contacts is minimal.</p> |
申请公布号 |
DE10063251(A1) |
申请公布日期 |
2001.07.05 |
申请号 |
DE2000163251 |
申请日期 |
2000.12.19 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
LAWLYES, DANIEL A.;KELLY, JAY L.;RASCHILLA, ANTHONY |
分类号 |
H01R12/71;H01R13/518;H01R13/533;H05K1/11;H05K3/32;(IPC1-7):H01R12/04;H01R43/00;B60R16/02;H05K3/30 |
主分类号 |
H01R12/71 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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