| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a chip is bonded in high mechanical strength to a resin filling material, in a structure for connecting a lead from an interposer to a bonding pad of the chip. SOLUTION: The semiconductor device has a structure connecting the lead 13 from the interposer (hereinafter a polyimide film 12) to the pad 14 of the chip 11, and the lead 13 is sparsely disposed. The leads from the interposer, that is, dummy leads 13' unrelated to electric connection are increased to bring the chip 11 into tight contact with the resin filling material 15 in high mechanical strength. The dummy lead connected to the interposer along with the lead improves bonding strength between the resin filling material and the chip. |
