APPARATUS FOR PLATING SUBSTRATE, METHOD FOR PLATING SUBSTRATE, ELECTROLYTIC PROCESSING METHOD, AND APPARATUS THEREOF

摘要

An apparatus for plating a substrate by filling a fine interconnection pattern (recess) formed in a semiconductor substrate with a metal such as copper (Cu) comprises a substrate holding section (36) for horizontally holding and rotating a substrate so oriented that the surface to be plate faces up, a sealer (90) that comes into contact with the periphery of the surface to be plated of the held substrate to seal the periphery water-tightly, and a cathode (88) that comes into contact with the substrate to supply current thereto, and further comprises a cathode section (38) rotatable with the substrate holding section (36), an electrode arm section (30) provided horizontally and vertically movably above the cathode section (38) and having an anode (98) oriented down, and plating solution injecting means for injecting a plating solution into the space between the surface to be plated of the held substrate and the anode of the electrode arm section (30) brought near to the surface to be plated. Therefore, the processings including the plating and its collateral processings are carried out by means of a single unit. A method for plating a substrate is also disclosed.