| 摘要 |
PURPOSE: A monitoring method of overlay measuring equipment is to provide a precise overlay precision, by comparing an overlay precision in an x-axis direction with an overlay precision in a y-axis direction. CONSTITUTION: A wafer(20) having an overlay pattern is inserted into wafer measuring equipment to measure overlay precision. The wafer is loaded at a zero degree, and an overlay precision is measured in a right/left direction and in a vertical direction. The wafer is loaded at 90 or 270 degrees, and an overlay precision is measured in a right/left direction and in a vertical direction. The overlay precision in a right/left direction is compared with the overlayer precision in a vertical direction.
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