发明名称 Surface treatment apparatus
摘要 The present invention provides a surface treatment apparatus which can treat a surface with high speed and high quality. A casing of a surface treatment apparatus is defined into two chambers, a plasma generation chamber provided with a plasma generation electrode and a substrate treatment chamber provided with a substrate support table. A plasma nozzle is formed on an anode electrode constituting a partition wall of the both chambers. A recess is formed on an upper cathode electrode. Further, the plasma nozzle is used as a hollow anode discharge generation area, and the recess as a hollow cathode discharge generation area.
申请公布号 US2001006093(A1) 申请公布日期 2001.07.05
申请号 US20000730813 申请日期 2000.12.06
申请人 TABUCHI TOSHIHIRO;ISHIDA KOUICHI;MIZUKAMI HIROYUKI;TAKASHIRI MASAYUKI 发明人 TABUCHI TOSHIHIRO;ISHIDA KOUICHI;MIZUKAMI HIROYUKI;TAKASHIRI MASAYUKI
分类号 C23C16/24;C23C16/452;C23C16/505;H01J37/32;(IPC1-7):C23C16/503 主分类号 C23C16/24
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