RESIN COMPOSITION FOR PEELABLE FILM

摘要

PURPOSE: A resin composition for peelable film capable of expressing easily peeling characteristics to each vessel without using polypropylene resin and polystyrene resin is provided, which is suitable for peelable film. The composition has a peeling strength of 0.5 to 1.2kg/15mm at a heat sealing temperature of 200deg.C or less. CONSTITUTION: This resin composition comprises 30 to 80% by weight of ethylene vinyl acetate resin having a vinyl acetate content of 22 to 46% by weight based on the total ethylene vinyl acetate resin, 10 to 40% by weight of low density polyethylene and 10 to 30% by weight of ethylene alpha-olefin resin containing C8.