发明名称 |
Stacked microelectronic assembly and method therefor |
摘要 |
A method of making a stacked microelectronic assembly includes providing a flexible substrate having a plurality of attachment sites, test contacts and conductive terminals, and including a wiring layer with leads extending to the attachment sites. The method includes assembling a plurality of microelectronic elements to the attachment sites and electrically interconnecting the microelectronic elements and the leads. The flexible substrate is then folded so as to stack at least some of the microelectronic elements in substantially vertical alignment with one another to provide a stacked assembly with the conductive terminals exposed at the bottom end of the stack and the test contacts exposed at the top end of the stack.
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申请公布号 |
US2001006252(A1) |
申请公布日期 |
2001.07.05 |
申请号 |
US20010776356 |
申请日期 |
2001.02.02 |
申请人 |
KIM YOUNG;HABA BELGACEM;SOLBERG VERNON |
发明人 |
KIM YOUNG;HABA BELGACEM;SOLBERG VERNON |
分类号 |
H01L23/538;H01L25/065;H05K1/18;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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