| 摘要 |
PURPOSE: A developer spraying apparatus of semiconductor developing equipment is provided to prevent a wafer from being damaged by vortex, by spraying developer on the wafer through a plurality of nozzles having an inclination of a predetermined angle to use a constant quantity of developer, and by spraying developer while the wafer is revolved. CONSTITUTION: A developer supplying pipe(12) is installed in the upper portion of a developer spraying apparatus of semiconductor developing equipment. A plurality of nozzles(15) for spraying developer(13) on the upper surface of a wafer(14) are installed in the lower portion of the developer spraying apparatus. The plurality of nozzles uniformly sprays developer on the entire surface of the wafer, having an inclination of a predetermined angle to avoid being damaged.
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