FIXING APPARATUS OF WAFERS FOR SEMICONDUCTOR REFLOW PROCESS

摘要

PURPOSE: A fixing apparatus is provided to improve a reflow performance by changing the fixing structure of wafers so that a gas being a heat transfer medium can be concentrated on the rear of the wafer and also reduce the time consumed in the process. CONSTITUTION: A fixing apparatus includes a heating stage having a plurality of gas supply holes(22) for supplying a gas such as Ar being a heat transfer medium. A wafer(30) is seated toward the rear of the heating stage, so that it can receive the gas heat. A fixing ring unit(42) fixes an edge of the top of the wafer so that it can not slip. A fixing element(40) has a shield unit(44) integrally extended to prevent leakage of the gas at the bottom of the fixing ring unit(42). A cylinder unit(50) has an elevating load(52) capable of elevating the fixing element(40).