INTEGRATED CIRCUIT

摘要

An integrated circuit device (l) comprises a motherboard (2), a module substrate (3), solder bumps (6), and support members (7a). The module substrate (3) is mounted on the motherboard (2), and electronic parts (4) are mounted on both sides of the module substrate (3). The motherboard (2) and the module substrate (3) are electrically connected by the solder bumps (6), and the support members (7a) are placed between the motherboard (2) and the module substrate (3) to control the inclination of the module substrate (3).