发明名称 |
Method of fabricating a three-dimensional system-on-chip and its structure |
摘要 |
A three-dimensional system-on-chip structure comprises a plurality of chips and a plurality of plugs respectively fabricated in the chips. The chips are stacked on top of each other and each includes a periphery circuitry region. A plurality of contact pads is fabricated in each of the periphery circuitry regions. The plugs are formed in the corresponding stacked chips, and are electrically connected to the corresponding contact pads of two of the corresponding chips which are adjacent to each other, or two of the corresponding chips which are not adjacent to each other. |
申请公布号 |
US2001006257(A1) |
申请公布日期 |
2001.07.05 |
申请号 |
US20010797542 |
申请日期 |
2001.03.01 |
申请人 |
SHIH CHIAN-GAUH;LU HSIN-PANG |
发明人 |
SHIH CHIAN-GAUH;LU HSIN-PANG |
分类号 |
H01L21/768;H01L21/8239;H01L23/48;H01L25/065;(IPC1-7):H01L23/52 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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