| 摘要 |
<p>An interconnection element of a spring (body), and a method for fabricating the interconnection element. The interconnection element is of a size suitable for directly contacting a semiconductor or a packaged semiconductor device such as in an LGA package. The method includes fabricating a multi-tiered structure to form a compact, resilient interconnect structure. Fabricating each tier or leaf includes providing a base substrate material, and applying a masking material over the base substrate material. An opening is patterned in the masking material and a resilient element is formed in the opening. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The method includes repeating this process one or more times to fabricate a chip-level interconnection element.</p> |
