METHOD FOR MANUFACTURING E-BGA

摘要

PURPOSE: A method for manufacturing an E-BGA(Enhanced Ball Grid Array) is provided to simplify an E-BGA manufacturing process by adhering a heat sink plate after manufacturing a P-BGA(Plastic BGA). CONSTITUTION: An inner layer circuit and an outer layer circuit are formed(1). A device adhering face is printed by using a photo-hardening ink(1). A heat sink plate adhering face is printed by using a thermosetting ink(1). A P-BGA(Plastic BGA) is manufactured by performing V-cut processing(1). The heat sink plate is manufactured by etching a copper metal and plating a nickel(2). An adhesive tape is adhered on the heat sink plate(3). The P-BGA is adhered(3).