| 摘要 |
A multilayer ceramic device (10B) has top and bottom green ceramic layers (16B, 18B) machined and fired. Intermediate green ceramic layers (66) are machined, have conductors (52, 54, 56, 58) laid down in the machined areas, are laminated, and are fired to form an enclosure layer (66). The areas of the layers (16B, 66, 18B) which will be in contact with each other are coated with a bonding agent (70). The layers (16B, 66, 18B) are aligned and bonded to form a structure (10B) having arbitrarily shaped, interior channels (32, 34, 36, 37) adjacent to the top (16B) and bottom layers (18B) which are not subject to detrimental non-planarities. <IMAGE> |
