| 摘要 |
PURPOSE: A wafer level package and a method for manufacturing the package are provided to prevent a solder ball from being transformed although thermal stress from the external is applied and to reduce the difference of the coefficient of thermal expansion between a package and a board. CONSTITUTION: The wafer level package includes a semiconductor chip, a lower part insulating layer(20), a metal pattern(30), an upper part insulating layer(21), a lower part solder ball(40), a sealing material(50) and an upper part solder ball(41). The semiconductor chip has a bonding pad. The lower part insulating layer is coated on a surface of the semiconductor chip on which the bonding pad is formed so that the bonding pad is exposed. The metal pattern is deposited on the lower part insulating layer so that one end of which is connected to the exposed bonding pad. The upper part insulating layer is coated on the lower part insulating layer so that other end of the metal pattern is exposed. The lower part solder ball is mounted on the other end of the metal pattern. The sealing material is transfer-molded on the upper part of the lower part insulating layer so that a part of the lower part solder ball is exposed and surrounds the entire of the lower part solder ball. The upper part solder ball is mounted to part of the lower part solder ball exposed from the sealing material.
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