Use of a solder material and process for manufacturing an electric or electronic device

摘要

Disclosed is a high-temperature solder material which is composed of tin, zinc and silver, or of 0.01 to 2 wt% germanium or aluminum and the balance tin, or tin and zinc at a ratio of 80/20 to 70/30. The tin/zinc/silver solder has a composition ratio that the ratio of tin to zinc is within a range of 97/3 to 79/21 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, or that the ratio of tin to zinc is within a range of 70/30 tn 5/95 by weight, and the ratio of silver to the sum of tin, zinc and silver is 15 % by weight or less. The solder material is used for producing electric or electronic devices and equipments.