LEAD FRAME FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A lead frame for semiconductor package is provided to be used as an air bent hole in a molding process and prevent shock to a lead frame in a mold flash removal process. CONSTITUTION: A lead frame for semiconductor package includes a frame body(2) of an approximate plate shape. A chip mounting plate(4) is formed in a rectangular plate so that a semiconductor chip can be mounted in a given region of the frame body. A tie bar(12) is extended from both opposing sides of the chip mounting plate and is connected to the frame body. A plurality of inner leads(6) are formed in a radial shape on an outer circumference of the chip mounting plate. Outer leads(8) are extended from the inner leads and are connected to the frame body. A dam bar(10) is connected to the frame body formed between the inner leads and the outer leads. Holes(15) are formed to be opposite to another at the frame bodies around respective tie bars toward the inner leads or the chip mounting plate.