WAFER MOUNT FRAME FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A wafer mount frame for manufacturing a semiconductor package is provided to cut a tape applied on the wafer mount frame clearly at one time and to enlarge the life-time of a blade used for cutting. CONSTITUTION: The wafer mount frame for manufacturing the semiconductor package includes a middle hole(4) and a depression hole(2a). The wafer mount frame according to the present invention has approximately a circular disk. The middle hole is bigger than the diameter of the wafer and is formed in the middle of the wafer. The depression hole has a circular shape and is formed along with the portion contacting the blade on the portion of the wafer mount frame on which the tape is to be applied.