| 摘要 |
PURPOSE: An apparatus for removing particles collecting in a lower part of a semiconductor chemical vapor deposition equipment is provided to prevent contamination of a wafer due to the particles. CONSTITUTION: The chemical vapor deposition equipment has a processing chamber(11) in which a process is carried out, a heater table(13) which is placed in the processing chamber(11) and on which the wafer(12) is mounted, a chamber lid(15) which is placed above the heater table(13) and in which a gas supply hole(14) is formed, a heater lift assembly(16) which is placed under the heater table(13), and a pump(17) which is connected to a side of the chamber(11) by an exhaust line. The equipment further has the apparatus(20) for removing the particles(18), and the apparatus(20) includes a cylindrical blower(21) formed at the lower part of the chamber(11). The cylindrical blower(21) has a plurality of holes opened upward, and the holes are connected to a purge line(22) and a pumping line(23) through a connection line(24) and a three-way valve(25). The particles(18) are scattered by a purge gas supplied through the purge line(22), and then exhausted through the pumping line(23).
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