发明名称 |
Light emitting diode |
摘要 |
<p>This invention provides a light-emitting diode which permits mass production and dense packing into a pattern based on the use of a reflow furnace. Its reflection mirror 15 is obtained by stamping a metal plate to give it a smooth concave shape, and treating its concave surface by plating or depositing, for example, silver. The reflection mirror 15 is placed in an opposing relation to the light-emitting surface of a light-emitting element 11; is shaped like approximately a paraboloid of revolution; and has a focal point at which the center of the light emitting surface of light-emitting element 11 is disposed. The light-emitting element 11, parts of lead assemblies 12a and 12b, a bonding wire 13 and the reflection mirror 15 is integrally sealed with a light transmissible material 14 by transfer molding. The surface of the light transmissible material 14 at the rear of the light-emitting element serves as a radiation surface 21. <IMAGE></p> |
申请公布号 |
EP1113506(A2) |
申请公布日期 |
2001.07.04 |
申请号 |
EP20000128513 |
申请日期 |
2000.12.27 |
申请人 |
TOYODA GOSEI CO., LTD. |
发明人 |
SUEHIRO, YOSHINOBU;TAKAHASHI, YUJI;KAGA, KOICHI;UCHIDA, KOUJI;SEKITOMI, YUJI |
分类号 |
H01L33/60;(IPC1-7):H01L33/00 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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