| 发明名称 |
SEMICONDUCTOR DEVICE WITH REINFORCING MEMBER, ITS MANUFACTURING METHOD, IC CARD, AND ITS MANUFACTURING METHOD |
| 摘要 |
PROBLEM TO BE SOLVED: To easily manufacture an IC chip with a reinforcing member. SOLUTION: After a reinforcing plate 3 composed of a carbon fiber plate is stuck by use of adhesives on the entire region on a reverse face of a wafer 1 of which a layer is thinned, dicing is carried on together with the reinforcing plate 3 to which the wafer 1 is stuck. |
| 申请公布号 |
JP2001185512(A) |
申请公布日期 |
2001.07.06 |
| 申请号 |
JP20000310525 |
申请日期 |
2000.10.11 |
| 申请人 |
NIPPON TELEGR & TELEPH CORP <NTT> |
发明人 |
UNNO HIDEYUKI;HENMI MANABU;OFUJI SHINICHI;TAKEDA TADAO |
| 分类号 |
B42D15/10;G06K19/077;H01L21/301;H01L25/00 |
主分类号 |
B42D15/10 |
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