CLAMP FOR WIRE BONDING OF BALL GRID ARRAY SEMICONDUCTOR PACKAGE AND METHOD FOR WIRE BONDING TEST USING THE SAME

摘要

PURPOSE: A clamp for wire bonding of a ball grid array semiconductor package and a method for wire bonding test using the same are provided to check easily a wire bonding state of a semiconductor package by using a grounding clamp with a grounding projection. CONSTITUTION: A grounding projection(21) of a clamp is contacted with a grounding solder ball land(24) when a clamp is connected electrically with a grounding line(18) of one side of a WBMS(Wire Bonding Monitoring System). A conductive wire of a capillary(CP) connected electrically with the other side of the WBMS. A multitude of bond pad(30) of a semiconductor chip(1) and a multitude of bond finger(32) of a resin circuit board(11) are bonded by the conductive wire of the capillary(CP).