| 摘要 |
PURPOSE: A wafer scale package is provided to prevent an electrical interference between lead wires and harden the strength of the lead wires. CONSTITUTION: A wafer scale package includes a wafer(51) in which a plurality of chip pads(53) are formed. An insulating tape(55) of a given pattern is attached to the top of the wafer(51). A plurality of lead wires(59) are adhered to lands(73) of a printed circuit board(71) when a tip portion in the middle of the lead wires(59) is mounted to the printed circuit board(71). Both ends of the lead wires(59) are bonded to respective chip pads(53) and the insulating tape(55). An insulating coating layer(61) fills the space between the lead wires(59) and is formed at a portion where the lead wires(59) arte bonded so that insulation between neighboring lead wires(59) can be made. A plating layer(63) is formed at the tip portion of the lead wires(59) in order to increase the strength of the lead wires(59). |
