| 摘要 |
PURPOSE: A package substrate having a cavity is provided to simplify the cavity forming process without etching the back surface of the substrate and to absorb the stress caused by different coefficients of thermal expansion and to easily manage the flatness by using the flat radiation substrate. CONSTITUTION: The package substrate having a cavity comprises a plurality of chip components(150) made from a thermosetting epoxy resin, an adhesive layer(100) having the same thickness of the chip component, a cavity formed on the adhesive layer by using a laser and by punching, a flat radiation substrate(120) made of copper, a circuit tape(140) having chip mounting holes(130) formed by using a laser and by punching, and a plurality of solder balls(170) mounted on the circuit tape. The adhesive layer is laminated on the radiation substrate. The circuit tape is laminated to the bottom of the adhesive layer. The chip components are mounted into the chip mounting holes and the metal wire connected to the chip component is connected to the circuit tape.
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