METHOD FOR FABRICATING PACKAGE SUBSTRATE

摘要

PURPOSE: A method for fabricating package substrate is provided to easily and accurately form the through hole by allowing an X-ray to be transmitted regardless of the thickness of heat radiation plate. CONSTITUTION: A method comprises the steps of removing an X-ray hole(110) formed at a heat radiation plate(100), by performing Z-axis process through the use of a router; stacking the heat radiation plate onto a CCL(copper-clad laminate)(140) where a reference point(120) is formed; and sensing, through an X-ray, the reference point formed at the CCL, forming a through hole(170) at an electrode(130) of the CCL by using a drill, and depositing a conductive material to the through hole formed at the electrode of the CCL. The reference point is formed at each of CCLs.