JIG FOR FIXING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A jig for fixing a semiconductor device is provided to collectively fix the devices to a carrier boat and to allow an automatic fixing operation. CONSTITUTION: The jig(130) is used for fixing the semiconductor devices(120) mounted in a row on the carrier boat(110). The semiconductor device(120) may be a package in which a semiconductor chip(124) is attached to a circuit substrate(122) having pins(128) by bumps(126). The jig(130) includes a thin platelike body(132) overlaid on the carrier boat(110) to fix the semiconductor devices(120) mounted on the carrier boat(110). The thin platelike body(132) has windows each exposing the semiconductor device(120), and protrusions(136) formed at upper parts of corners of each window. The protrusions(136) extended inwardly to the window press down corners of the circuit substrate(122), so that the semiconductor device(120) can be fixed to the carrier boat(110).