| 摘要 |
PURPOSE: A stacked substrate is provided to prevent signal reflection by maintaining the insulation layer at constant thickness, and prevent time delay of signal transmission by matching the designed resistance of parts and the designed resistance of PCB. CONSTITUTION: A stacked substrate comprises a plurality of CCLs(copper-clad laminates)(110) having electrode patterns(100) stacked onto and beneath the CCL and first insulation layers(120) stacked onto and beneath the CCL; copper sheet layers(130) stacked to the first insulation layers; second insulation layers(140) stacked to the copper sheet layers through a pressing and drying process; and electrode layers(150) stacked to the second insulation layers. The second insulation layer is made up of epoxy dry film, and stacked to the copper sheet layer by being pressed at a pressure of 170 to 190Kg/cm¬2 and a temperature of 40 to 70°C for 10 to 20 seconds, secondly pressed at a temperature of 140 to 160°C for 10 to 20 seconds, and dried at a temperature of 150°C for 10 to 20 seconds.
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