| 摘要 |
PURPOSE: A semiconductor package is provided to mount a semiconductor chip which is 3.5 times as big as a conventional small outline integrated circuit(SOIC)-type semiconductor package while the overall size of the semiconductor package has the same size as the SOIC-type semiconductor package. CONSTITUTION: A plurality of input/output pads(2a) are formed on a semiconductor chip(2). A chip mounting plate(4) is adhered to a back surface of the semiconductor chip by using adhesive(3a). A plurality of inner leads(6) are formed in an outer portion of the chip mounting plate, separated at a predetermined interval. An etching portion(6a) is formed in an end portion of the inner leads facing the chip mounting plate. A conductive wire(8) electrically connects the input/output pads of the semiconductor chip with the inner leads. The semiconductor chip, the conductive wire, the chip mounting plate and the inner leads constituting a body(10) are encapsulated with an encapsulating material, in which the lower surfaces of the chip mounting plate and the inner leads are exposed to the exterior. |
