| 摘要 |
PURPOSE: A method for manufacturing a merged ceramic module package is provided to increase degree of circuit integration, to improve thermal stabilization, and to solve a problem of insulation strength. CONSTITUTION: In the method, after receptive holes(242) are formed in a metal substrate(240), the metal substrate(240) is oxidized and then treated with glaze. Next, an upper green sheet assembly(250) having conductive pads(224) corresponding to the receptive holes(242) is prepared, and also a lower green sheet assembly(260) having insertional holes(262) corresponding to the receptive holes(242) is prepared. Next, the upper and lower green sheet assemblies(250,260) are attached to the metal substrate(240) and then sintered. Next, conductor lines are formed on both sides of the green sheet assemblies(250,260) to form the merged module package(200), and then the green sheet assemblies(250,260) are electrically connected to each other by solder(264) filled in the holes(242,262) to the pads(224). Next, integrated circuit chips(210) and surface mounted devices(220) are mounted on the upper green sheet assembly(250) by screen printing, and then epoxy(266) is coated under the lower green sheet assembly(260) to block up the insertional holes(262) filled with the solder(264).
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