APPARATUS FOR COMBINING BGA BOARD OF PRINTED CIRCUIT BOARD

摘要

PURPOSE: An apparatus for combining a BGA board of a printed circuit board is provided to prevent a heat distortion of a PCB and a BGA board by easily combining the BGA board onto the PCB without the need for heating a solder ball for combining the BGA board. CONSTITUTION: A BGA mounting unit(130) in which a BGA board(120) is installed on a PCB board is formed. A conductor pad(140) is printed in the BGA mounting unit(130). A solder ball(150) formed in the lower part of the BGA board(120) is respectively contacted with the conductor pad(140). The BGA board(120) is mounted. A plurality of solder balls(150) are located in the upper side of each conductor pad(140) printed in t he BGA mounting unit(130) of the PCB(110). A penetration hole(160) is formed on each edge of the BGA board(120). The solder balls(150) in the lower part of BGA board(120) are contacted with the conductor pad(140) without the need for soldering by heat at a fixed pressure. Therefore, a heat distortion of the PCB(110) and the BGA board(120). The PCB(110) is combined with the lower part of a bolt(170) which combines the BGA board(120). Therefore, it prevents the BGA board(120) from being separated from the PCB(110).