| 摘要 |
PURPOSE: A semiconductor wafer cutting apparatus is provided to prevent DI water under a high pressure and Si dust from remaining on a wafer by using a high-pressure air spray means within a process chamber. CONSTITUTION: A semiconductor wafer cutting apparatus includes a process chamber for performing a wafer cutting work. The process chamber has an air spray means(51) for cleaning DI water and Si dust remaining on a wafer(9), a driving unit(36) moved in a 2 axis(X,Y axis) and a wafer sensing unit for sensing a chuck table(8) for fixing/transferring the driving unit and the wafer. A wafer supply unit supplies the wafer to be cut into the process chamber. A cleaning unit cleans the cut wafer. A control unit controls respective functions of the apparatus. A monitor unit monitors an operation situation within the process chamber.
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