发明名称 METHOD FOR MANUFACTURING CHIP COMPONENT
摘要 PURPOSE: A method for manufacturing a chip component is provided to minimize variation in electric characteristic, form a precise terminal electrode and improve productivity. CONSTITUTION: A ground electrode(140), a marking(130) and a terminal electrode(150) are formed by a printing to be electrically separated from each other on the first ceramic sheet which is laminated and printed. An inside electrode(100) is formed such that both ends of the inside electrode is protruded to an upper surface on the second ceramic sheet which is laminated and printed on the first ceramic sheet. A chip block(120) is formed by forming the ground electrode and the terminal electrode on the third ceramic sheet which is laminated and printed on the second ceramic sheet. A lateral surface electrode(150) is formed by a printing to be connected at least a part of the terminal electrode which is formed on an upper surface of the chip block and to be connected at least a part of the inside electrode. The chip block is formed by cutting a green bar in a standard size.
申请公布号 KR20010057123(A) 申请公布日期 2001.07.04
申请号 KR19990058901 申请日期 1999.12.18
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, DAE HYEONG;PARK, SEONG YEOL
分类号 H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/00
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