MAGAZINE FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A magazine for a semiconductor package is provided to hold a lead frame horizontally from the magazine having plurality of lead frames and to place the lead frame on a jig. CONSTITUTION: The magazine for a semiconductor package includes a body(63), a plurality of contain rails(61) as well as a contain hole(62). The body has a hollow cubic shape and two directions thereof which faces each other are penetrated. The contain rails are formed in a straight line on positions aligned with each other so as to contain a plurality of lead frames inside of the body. The contain hole formed between the contain rails. A depression hole(64) of a predetermined depth is further formed along with the contain rail on one penetrated side of the body so as to insert one side of the jig therein. The depression hole is further formed on both penetration directions of the body.