发明名称 Microgapping process for magnetic cores
摘要 <p>A magnetic device is assembled by first applying an adhesive to the end surface of a leg of one core portion, slipping a bobbin onto one of the legs (preferably a different leg) of the core portion, and mating the two core portions together. Then while observing the inductance of the coil, the two core portions are ground toward each other, gradually narrowing the adhesive-induced gap between the mating surfaces, until the desired inductance is achieved. The adhesive is then cured. Preferably the adhesive includes particulate matter to help resist the narrowing of the gap during the grinding process. Alternatively, the particulate matter can be applied to the mating surface without adhesive, and the resulting assembly can be clamped together. &lt;IMAGE&gt;</p>
申请公布号 EP1113464(A2) 申请公布日期 2001.07.04
申请号 EP20000127941 申请日期 2000.12.21
申请人 ALCATEL USA SOURCING, L.P. 发明人 BILLINGS, ROBERT L.
分类号 H01F3/14;H01F21/08;H01F27/26;(IPC1-7):H01F41/02 主分类号 H01F3/14
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