发明名称 |
LOW TEMPERATURE OF HEAT-ADHESIVE POLYOLEFIN RESIN COMPOSITION |
摘要 |
PURPOSE: A polyolefine resin composition is provided which has excellent low temperature of heat-adhesibility, transferring effect and high temperature of water resistance. CONSTITUTION: The polyolefin resin composition comprises: (i) 5-30 wt.% of a grafting monomer grafted linear low density polyethylene copolymer which is prepared by grafting 0.25-5.0 wt.% of one or two kinds of grafting monomers selected from the group consisting of ethylene unsaturated carboxylic acid, ethylene unsaturated carboxylic anhydride and ethylene unsaturated carboxylic ester with a linear low density polyethylene copolymer; (ii) 30-60 wt.% of an ethylene vinyl acetate copolymer; (iii) 10-20 wt.% of a polystyrene; and (iv) 5-15 wt.% of an ethylene butylene block copolymer.
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申请公布号 |
KR20010055733(A) |
申请公布日期 |
2001.07.04 |
申请号 |
KR19990057013 |
申请日期 |
1999.12.13 |
申请人 |
SAMSUNG GENERAL CHEMICALS CO., LTD. |
发明人 |
HONG, JONG SU;KIM, YEONG HWAN;LEE, SANG U;LEE, SEONG MAN |
分类号 |
C09J131/04;(IPC1-7):C09J131/04 |
主分类号 |
C09J131/04 |
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地址 |
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