| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to reduce manufacturing cost, to realize a thinner package, and to simplify manufacturing processes, while employing a typical printed circuit board. CONSTITUTION: The package(100) includes the circuit board(10) having a resin layer(11) in which a cavity(15) is formed to accommodate a semiconductor chip(2) having I/O pads(2a) formed thereon. The circuit board(10) further has an upper circuit pattern having bond fingers(12) on the resin layer(11), a lower circuit pattern having lands(13) under the resin layer(11), and via holes(14) connecting the upper and lower circuit patterns. In addition, the cavity(15) is closed by a supporting plate(50), which is attached under the circuit board(10), and to which the chip(2) is mounted. The package(100) further includes conductive wires(30) electrically connecting the I/O pads(2a) of the chip(2) to the bond fingers(12) of the circuit board(10), a glass lid(20) attached around the bond fingers(12) through a dam(21) so as to protect the chip(2) and the wires(30), and conductive balls(17) formed on the lands(13).
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