| 摘要 |
<p>PURPOSE: A semiconductor charge coupled device package is provided to attain a reduction in size of the package. CONSTITUTION: The package includes a multilayered ceramic body(11) having a chip mounting area, a semiconductor chip(12) attached to the chip mounting area of the ceramic body(11) by an adhesive(13), a plurality of terminal leads(15) each formed in the ceramic body(11) and having an inner end extended toward the chip mounting area and an outer end protruded outward, a transparent acrylic cover(14) adhered to upper peripheral sides of the chip(12) and the ceramic body(11) by an adhesive(17) to cover the chip(12), and connection leads(16) each formed in the acrylic cover(14) and having an inner end electrically connected to a chip pad on the chip(12) and an outer end electrically connected to the terminal lead(15).</p> |
