发明名称 THERMAL BONDING CUTOFF PLATE FOR COMMUNICATION HOLE
摘要 PURPOSE: A thermal bonding cut off plate is provided to contain a heating unit on a cutoff plate, to thermal bond the cutoff plate and to promptly operate waterproof a connect portion. CONSTITUTION: A thermal bonding cutoff plate comprises: an inserted cutoff plate(12) mounted along an end portion of a concrete block(10); a heating unit installed on a peripheral face of the inserted cutoff plate; a bonding member(15) melted by the heating unit while being attached to an inner circumference of the inserted cutoff plate; a connect cutoff plate(16) isolating the connect portion of the concrete block by being fixed on the inserted cutoff plate; and a power supply device supplying power to a nichrome electric resistance wire(20) mounted along a peripheral face of the inserted cutoff plate. The resistance wire is a tape composed of the same materials with a melt bonding member(14) to be fixed on the inserted cutoff plate. Thereby, the thermal bonding cutoff plate improves workability by simplifying waterproof process and extent a life span of the building by improving waterproofness.
申请公布号 KR20010057096(A) 申请公布日期 2001.07.04
申请号 KR19990058865 申请日期 1999.12.18
申请人 KOREA TELECOM 发明人 LEE, CHANG HO;NOH, YONG GYUN;SEO, MYEONG U
分类号 E02D31/00;(IPC1-7):E02D31/00 主分类号 E02D31/00
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